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OEM Oxide Alumina Ceramic Plates For Semiconductor Packaging 3300Mpa

Basic Information
Place of Origin: WUXI JIANGSU CHINA
Brand Name: HENGYUAN
Certification: CE,UL
Model Number: 95% Alumina Ceramics
Minimum Order Quantity: 100
Price: $1-$20
Packaging Details: Carton
Delivery Time: 20 DAYS
Payment Terms: L/C, T/T
Supply Ability: 5000 PCS/WEEK
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Detail Information
Material: 95% Alumina Ceramics Color: White
Density: 3.6g/cm³ Compressive Strength: 3300 Mpa
OEM,ODM: Acceptable Orgin: WUXI JIANGSU CHINA
MOQ: 100 PCS Package: Carton
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Product Description

OEM Oxide Alumina Ceramic Plates For Semiconductor Packaging (3300Mpa)
Premium Ceramic Solution for Electronics and Semiconductor Industry

High-performance 95% alumina ceramics offering exceptional mechanical, thermal, and electrical properties for demanding industrial applications.

Key Specifications
Attribute Value
Material 95% Alumina Ceramics
Color White
Density 3.6g/cm³
Compressive Strength 3300 Mpa
Customization OEM/ODM Acceptable
Origin Wuxi Jiangsu, China
Minimum Order Quantity 100 PCS
Package Carton
Product Overview

Alumina ceramics are widely used across multiple industries due to their superior performance characteristics. Our 95% alumina ceramics meet both general usage requirements and specialized performance needs.

Particularly suited for the electronics industry, these ceramics are commonly employed in semiconductor packaging and focusing potentiometers. Their excellent properties make them the most frequently used ceramic material in industrial applications.

Technical Comparison of Alumina Ceramic Grades
Material Unit A95% Alumina Ceramics A97% Alumina Ceramics A99% Alumina Ceramics A99.7% Alumina Ceramics
Density g/cm³ 3.6 3.72 3.85 3.85
Flexural Strength Mpa 290 300 350 350
Compressive Strength Mpa 3300 3400 3600 3600
Modulus of Elasticity Gpa 340 350 380 380
Impact Resistance MPam1/2 3.9 4 5 5
Weibull Modulus M 10 10 11 11
Vickers Hardness HV0.5 1800 1850 1900 1900
Thermal Expansion Coefficient 10-6K-1 5.0-8.3 5.0-8.3 5.4-8.3 5.4-8.3
Thermal Conductivity W/Mk 23 24 27 27
Thermal Shock Resistance △T℃ 250 250 270 270
Maximum Use Temperature 1600 1600 1650 1650
Volume Resistivity at 20℃ Ω ≥1014 ≥1014 ≥1014 ≥1014
Dielectric Strength KV/mm 20 20 25 25
Dielectric constant εr 10 10 10 10
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